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Michael Grady
Honeywell
michaelgrady@ieee.org
Kenle Chen
University of Central Florida
kenle.chen@ucf.edu
Nathan Jeong
University of Alabama
shjeong@eng.ua.edu
Enrique Gonzalez
Qorvo
Enrique.J.Gonzalez@ieee.org
Eduardo Rojas
Embry-Riddle Aeronautical University
rojas1@erau.edu
Stavros Vakalis
University of South Florida
vakalis@usf.edu
Jim Culver
Raytheon
jwculver@ieee.org
Xun Gong
Xun.Gong@ucf.edu
Angie Rogers
Modelithics
arogers@modelithics.com​
James Hofer
Accurate Circuit Engineering
james@ace-pcb.com
Ryan Baker
Macom
ryan.baker@macom.com
Michael Hallman
Microwave Journal
mhallman@mwjournal.com
Arya Menon
Texas A&M university
aryamenon@tamu.edu
Nick Miller
Michigan State University
ncmiller@msu.edu
Bayaner Arigong
Florida A&M University/ Florida State University
barigong@eng.famu.fsu.edu
Satheesh Bojja
Florida Int'l University
sbojjave@fiu.edu
Aditya Dave
Samsung Research America
aditya.dave@samsung.com
Jin Wang
University of South Florida jingw@usf.edu
Tom Weller
Oregon State University
tom.weller@oregonstate.edu
Anish Jha
Motorola Solutions
anish.jha@motorolasolutions.com
Gaurangi Gupta
NASA / JPL-Caltech
gaurangi.gupta@jpl.nasa.gov
Matt Ozalas
Keysight
matthew_ozalas@keysight.com
Larry Dunleavy
ldunleavy@modelithics.com
