Keynote Speakers
Dr. Tom Weller
Topic: Microfluidics, Thermal Management, and Partnership: The Creation of a New High Tech Ecosystem
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When: Monday, April 14, 10:10 am to 10:50 am
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Affiliation:
Michael and Judith Gaulke Chair in Electrical Engineering and Computer Science
Professor and Head, School of Electrical Engineering and Computer Science, College of Engineering
Oregon State University
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Abstract:
The Corvallis Microfluidics (CorMic) Tech Hub was designated by the U.S. Economic Development Administration in October 2023, recognizing the potential for Oregon’s Willamette Valley to become the global leader in microfluidics in the next 5-10 years. Microfluidics will enable important technological advances across many industries, including biotech, chemical manufacturing, and semiconductor packaging. The impact on the semiconductor industry is especially notable, as microfluidics-based thermal management solutions will dramatically reduce the power draw for data centers, radars, and automotive electronics. CorMic’s strong technology base is only one ingredient for a growing ecosystem, however. The real strength is drawn from a diverse consortium of over 65 stakeholder organizations across multiple sectors – industry, economic development, higher education, venture development, community-based, and government. This presentation shares CorMic’s brief history from designation to implementation, highlighting its strategy to rapidly accelerate technology maturation and economic development that can serve as a model for others to follow.
Dr. David Arnold
Topic: Opportunities for Magnetic Materials in Next-Generation Wireless Systems
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When: Tuesday, April 15, 10:00 am to 10:40 am
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Affiliation:
Director, Florida Semiconductor Institute
George Kirkland Engineering Leadership Professor, Department of Electrical and Computer Engineering, University of Florida
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Abstract:
In this talk, I will highlight opportunities for integrating magnetic materials into next-generation wireless systems, focusing on their role in enhancing RF and power subsystems. I will first describe our group’s advances in electromagnetic absorbing materials tailored for 5G and 6G Tx/Rx modules, addressing interference challenges in mmWave and sub-THz bands. Next, I will present our development of PCB-integrated magnetic circulators for mmWave applications, achieving compact, high-isolation solutions intended for full-duplex communication at 35 GHz. I will then discuss our work on MHz-GHz microinductors for integrated power converters, enabling efficient, miniaturized energy delivery for wireless devices. Concluding, I will summarize our efforts in magnet-based wireless power transmission, showcasing innovative approaches to improve range and power for truly wireless systems.
Dr. John Papapolymerou
Topic: Heterogeneous Integration and Packaging of RF Electronics and Components for 5G+ Wireless Communication Systems Using Additive Manufacturing Techniques
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When: Tuesday, 11:20 am to 12 pm
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Affiliation:
Interim Dean, Professor, Engineering Dean's Office, College of Engineering, Michigan State University
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Abstract:
As we approach the physical limits of transistor technology and taking into account the financial challenges of building the relevant foundries, integration and packaging of different chiplets that are readily available will be a key factor for the successful development of cost-effective hardware for future 5G+ wireless communication and sensing systems that will enable a plethora of applications important to humanity. This talk will present the usage of additive manufacturing technologies as a promising solution for the heterogeneous integration and packaging of a variety of RF chiplets and components with a focus on Aerosol Jet Printing (AJP) that can achieve manufacturing resolution in the order of 10 microns. The presentation will cover the AJP fundamentals and several examples of integrated RF modules and components.