Workshop Session #1
Title: Advanced Packaging and Heterogeneous Integration Technologies: Motivation, Trends, and Opportunities
​Speaker: Muhannad Bakir
Affiliation: Georgia Tech University
Abstract:
In recent years, the field of advanced packaging has taken center stage as the semiconductor industry pursues ever more energy efficient, high-performance, and low-cost electronic systems. While the field of advanced packaging is undergoing revolutionary technology advances today, there is little doubt that advanced packaging in the new era of Moore’s Law will offer extreme levels of die integration/bonding and begin to blur the boundary between on- and off-chip connectivity due to ever denser physical I/O interfaces/bonds. First, we present the motivations to chiplet based architectures and design considerations. Next, we present a survey of recent advanced packaging technologies covering 2.5D and 3D technologies. Further, emerging HI technologies based on glass-core packaging and their motivation will also be discussed, including for RF/mm-wave applications. Thermal considerations for emerging packaging technologies will also be presented.​​​
Workshop Session #2
Title: Overview of Phased Array Antenna Systems and Practical Design Considerations
​Speaker: Daniel Ramirez
Affiliation: L3/Harris
Abstract:
Phased array antenna systems are becoming more ubiquitous as fabrication costs decrease, with applications spanning from government to commercial. The desire for multiple functions on single arrays and higher data rates drives many applications to require wideband systems, leading to increased challenges in design. In this talk, we will provide an overview of phased array antenna systems and discuss some key applications which drive the need for wideband capabilities. We will then present a few of the major challenges in phased antenna array system design, such as sizing of an array, time delay architecting, and properly tracking non-linear products.​​​